UB - University at Buffalo, The State University of New York UB Mechanical and Aerospace Engineering
  • photo of Deborah D.L. Chung

  • Deborah D. L. Chung, Professor

  • Education: Ph.D., Materials Science, Massachusetts Institute of Technology, 1977
    Office: 608 Furnas Hall
    Phone: (716) 645-3977
    FAX: (716) 645-2883
    E-mail: ddlchung .at. buffalo.edu
    Home Page: http://wings.buffalo.edu/academic/department/eng/mae/cmrl
    Curriculum Vitae: Click for PDF
    Research Interests: Materials science and engineering, particularly smart materials, concrete, thermal management, battery electrode materials, carbon fibers and filaments, composites processing and interfaces, metal-matrix composites, electronic packaging materials, and activated carbon.

    Selected Papers, Publications, & Presentations:

    • D.D.L. Chung, "Damage Detection Using Self-Sensing Concepts" (Invited Review), J. Aerospace Eng. (Proceedings of the Institution of Mechanical Engineers, Part G) 221(G4), 509-520 (2007).
    • Daojun Wang and D.D.L. Chung, "Through-Thickness Stress Sensing of Carbon Fiber Polymer-Matrix Composite by Electrical Resistance Measurement", Smart Mater. Struct. 16, 1320-1330 (2007).
    • Seungjin Han, Jan T. Lin, Yasuhiro Aoyagi and D.D.L. Chung, "Enhancing the Thermal Conductivity and Compressive Modulus of Carbon Fiber Polymer-Matrix Composites in the Through-Thickness Direction by Nanostructuring the Interlaminar Interface with Carbon Black", Carbon 46(7), 1060-1071 (2008).
    • D.D.L. Chung, "Electrical Applications of Carbon Materials", J. Mater. Sci. 39(8), 2645-2661 (2004).
    • D.D.L. Chung, "Electrical Applications of Carbon Materials", J. Mater. Sci. 39(8), 2645-2661 (2004).
    • Yasuhiro Aoyagi, Chia-Ken Leong and D.D.L. Chung, "Polyol-Based Phase-Change Thermal Interface Materials", J. Electron. Mater. 35(3), 416-424 (2006).
    • Kyu Dong Kim and D.D.L. Chung, "Electrically Conductive Adhesive and Soldered Joints under Compression", J. Adh. Sci. Tech. 19(11), 1003-1023 (2005).
    • Zongrong Liu and D.D.L. Chung, "Comparative Study of Electrically Conductive Thick Films With and Without Glass", J. Electron. Mater. 33(3), 194-202 (2004).
    • Chuangang Lin and D.D.L. Chung, "Nanostructured Fumed Metal Oxides for Thermal Interface Pastes", J. Mater. Sci., 42(22), 9245-9255 (2007).
    • D.D.L. Chung, "Electrically Conductive Cement-Based Materials", Adv. Cem. Res. 16(4), 167-176 (2004).
    • Sihai Wen and D.D.L Chung, "Self-Sensing of Flexural Damage and Strain in Carbon Fiber Reinforced Cement and Effect of Embedded Steel Reinforcing Bars", Carbon 44(8), 1496-1502 (2006).